Abstract

A wide variety of MEMS technologies, covering inertial, environmental, optical and acoustic applications, are commonly used in daily life. The smartphone exemplifies this phenomenon by integrating all of the above into a compact and powerful platform. The IoT revolution, in its turn, promises to drastically increase the usage of both smart and passive sensors as they get adopted into the personal and commercial aspects of our lives. 

One of the common features of MEMS processing is wafer bonding. There are several different bonding technologies in production today, and each has its advantages and disadvantages. Xperi has developed ZiBond (oxide to oxide direct bonding) and DBI (Cu/oxide hybrid bonding) for a variety of 3D stacked applications. In MEMS processing, ZiBond offers low temperature bonding to a variety of substrates, low cost and high bond strength. In addition to the above, DBI promises increased hermeticity and greater architectural flexibility when stacking MEMS on ASIC. Data supporting these attributes will be presented and discussed.