Advanced Research Infrastructure for Materials and Nanotechnology in Japan
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ALTECH Co., Ltd.
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Altech is a high-tech minded trading house that introduces cutting-edge and novel technology solutions from EU & US start-ups. We provide solutions to your challenges through niche and unique offerings such as high-precision capillary force printing system capable of drawing ultra-fine lines at the sub-micron scale, non-contact optical surface particle inspection, spectroscopy-applied thin-film thickness measurement, NIL applied microfabrication, and high-precision motion control system. - Title of Exhibitor Presentation
CANON ANELVA CORPORATION
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Introducing the New Atomic Diffusion Bonding (ADB) Methode-Single-sided film deposition ADB-
D-process Inc.
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Introduction to CMP ＆ bonding processing services
ELIONIX INC.
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We’d like to introduce our electron beam lithography systems and ECR ion beam sputtering systems. If you are looking for solutions for micro-nanofabrication, please visit our booth. - Title of Exhibitor Presentation
From Resolution to Throughput ~ Rethinking EBL for MEMS Fabrication ~
Hightec Systems Corporation
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Ion Beam Process Equipment for MEMS Technology
HiSOL, Inc.
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Centered on live demos of inkjet and maskless lithography, plus posters on bonding and polishing, we offer MEMS R&D solutions. - Title of Exhibitor Presentation
AML Wafer Bonding System – Ideal Equipment for Research and Development
Institute of Microelectronics (IME)
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Established in 1991, the Institute of Microelectronics (IME), part of A*STAR Singapore, advances semiconductor innovation with a strong focus on technology translation. Specializing in next-generation piezoelectric MEMS, we bridge design to fabrication, enabling seamless transition from concept to industrialization through robust platforms, integrated ecosystems, and efficient, low-risk technology transfer. - Title of Exhibitor Presentation
INTRODUCTION TO IME (IMEの紹介)
i-ROM GmbH
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Designing MEMS is no longer time consuming and expensive. We are a MEMS design house offering both: MEMS design consulting and software specifically for MEMS design, the i-ROM MODELBUILDER. If you have an idea for a MEMS sensor – we have the way to get there. Whether it’s micromirrors, angular rate sensors or gyroscopes. We help you with the design until your MEMS sensor meets the desired requirements. With our software you can shorten the expensive and lengthy design process from an average
of 3 to up to 1.5 years. Time that is worth a tremendous amount of money. - Title of Exhibitor Presentation
Challenges in Modeling and Simulation of MEMS
KOKEN LTD.
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Koken Ltd. provides KOACH, an advanced clean system using proprietary airflow and filtration technology to achieve ultra-clean environments in open spaces. Ideal for MEMS and semiconductor applications, it effectively controls particles. Visit our booth to experience a live demo. - Title of Exhibitor Presentation
Koushin Special Glass Co.,Ltd
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With the mission of “Creating customer values by collaborating team work and innovation,” Koushin Special Glass Co., Ltd. introduces precision processing technologies for quartz and ceramic components in semiconductor manufacturing. Driven by our “Bakusoku Keiei” (lightning-fast management) philosophy, we deliver rapid responses to meet your specific needs. Our booth will feature informative panels and custom samples demonstrating our machining accuracy. We welcome you to view these exhibits and consult with us about tailored solutions. We look forward to seeing you. - Title of Exhibitor Presentation
Quartz and Ceramic Processing and Cleaning Technologies by Koushin Special Glass Supporting Cutting-Edge Semiconductor Manufacturing Processes
Kyodo International Inc./Silex
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Introducing Swedish pure play MEMS foundry “Silex” and our contracted prototyping services - Title of Exhibitor Presentation
Your One-Stop Solution for MEMS & Nano/Micro fabrication
Micromachine Center
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Nisshinbo Micro Devices Inc.
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Nisshinbo Micro Devices has adopted “Connect Everything” as its mission and continues to grow and evolve toward the realization of a highly advanced smart society. At this exhibition, we will introduce ranging solutions using optical, ultrasonic, and microwave sensors, as well as acoustic sensors for predictive maintenance. Through a variety of demonstrations, visitors will be able to experience the new value created by our smart sensing solutions. - Title of Exhibitor Presentation
Smart Sensing Solutions by Nisshinbo Micro Devices
Niterra Co, Ltd. / NTK CERAMIC CO., LTD.
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NTK Ceramic manufactures and sells ceramic packages, excelling in custom designs tailored to your specific applications. Our ceramic solutions offer superior rigidity, thermal management and hermeticity, making them the perfect solution for high-end MEMS devices that demand exceptional reliability. We have a strong track record of shipments in this field, and with our proven technology, we will support the cutting-edge device development of our customers. At the exhibition, we will be introducing our latest technologies and products, so please, by all means, come visit our company booth, B-10, located in the KFC Hall Annex (3F). - Title of Exhibitor Presentation
Elevating MEMS Performance: Advanced Ceramic Packaging Solutions by NTK
Otsuka Electronics Co., Ltd.
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Here are some of our main exhibit topics. We will present measurement examples related to semiconductor CMP, cleaning, and bonding processes using our zeta potential and particle size distribution analyzer (ELSZneo series). Our new product, Three-Dimensional Optical Wave-Field Microscope（the MINUK series）, offers a unique technology that allows for instantaneous observation of surface shape, surface defect, internal defect, and alteration of transparent materials. We will introduce some of the main measurement examples. - Title of Exhibitor Presentation
Introduction of Otsuka Electronics
Plasma-Therm-Japan K.K.
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From Lab to Fab, Plasma-Therm helps enhance the Human Experience by enabling Advanced Technologies. - Title of Exhibitor Presentation
Shuttleline (Corial) platform: Insights on Photonic applications
Polytec Japan
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Polytec Micro System Analyzer MSA series is an advanced tool for ODS analysis of MEMS sensors and devices. It can evaluate out-of-plane vibrations up to 8 GHz, in-plane vibrations up to 2.5 MHz, and full 3D motion. Even silicon‑capped products can be measured through the cap, enabling true functional evaluation. The MSA series offer solutions tailored to your application needs and budget. - Title of Exhibitor Presentation
Wafer-level Testing with MSA-600
ROHM CO., LTD.
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We would like to introduce ROHM’s technology, which is uniquely capable of meeting the requirements for hydrogen sensing—a critical component of a sustainable society—precisely because it is based on MEMS technology. - Title of Exhibitor Presentation
ROHM’s MEMS Technology Supporting the Realization of a Sustainable Society
SAES Getters S.p.A.
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We introduce getters for vacuum sealed packages that maintain the required vacuum level inside packages such as infrared sensors, gyro sensors, and pressure sensors immediately after encapsulation to ensure long-term stability of performance. We also offer getter materials that can adsorb moisture, hydrogen, and VOC gases, which were developed for dry air/gas replacement packages for optical devices, etc. We will propose the most suitable getters according to device type and application and contribute to the long-term stabilization of our customers’ products. - Title of Exhibitor Presentation
Getters and their essential role in assuring performance and long-term reliability of MEMS Devices
SAKAGUCHI ELECTRIC HEATERS CO.,LTD.
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Our “Atomic-Antialiasing Annealing Minimal Fab Tool” was developed through collaboration between industry, government, and academia. Rapid heating using a laser enables precise hydrogen annealing in a short amount of time. This exhibition features mirror devices created using the Minimal Fab tool. With “Minimal Fab,” you can manufacture a device in just two days. We used the “Creative Minimal Fab” facility at AIST to fabricate the device. - Title of Exhibitor Presentation
Mirror Fabrication via Minimal Laser Hydrogen Annealing
SPP Technologies
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At our booth, we will showcase manufacturing equipment for AI, data centers, and advanced packaging, as well as for power devices (SiC/GaN) and optoelectronic compound semiconductor devices—both of which are expected to see continued growth. In addition, we will introduce equipment for MEMS sensors and actuators. - Title of Exhibitor Presentation
Sumitomo Precision Products Co., Ltd.
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MEMS Infinity is a dedicated MEMS foundry providing seamless support from device design through prototyping to volume production. To meet growing production demand, we have expanded our engineering team and manufacturing capabilities. In piezoelectric thin films, we now offer KNN film deposition and processing alongside our established PZT technology. With the introduction of an i-line stepper, we achieve fine patterning at 0.35 μm L/S resolution and precise dual-sided processing through backside alignment. From prototype to production, MEMS Infinity is your partner in accelerating MEMS device development. - Title of Exhibitor Presentation
Status Update on MEMS Foundry Services Provided by MEMS Infinity
SUSS MicroTec KK
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At our booth, we will present integrated process solutions for MEMS manufacturing, featuring advanced lithography and wafer bonding technologies. These solutions deliver high-precision alignment, excellent throughput, and flexibility for a wide range of MEMS applications. We will also showcase our environmentally conscious wafer cleaning solution, “GreenTrack,” designed to significantly reduce usage of restricted chemicals while maintaining superior cleaning performance. This innovative technology will be further explained in a dedicated short presentation during the exhibition. We warmly invite you to visit our booth to explore how our solutions can support both high performance and sustainability in MEMS production. - Title of Exhibitor Presentation
New Wafer Cleaning System with All-in-One Solution for Environmental Impact Reduction
TANAKA PRECIOUS METAL TECHNOLOGIES CO., LTD.
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Sintered Au Particle Bump Bonding Technology, AuRoFUSE™ Preform
TAZMO CO., LTD.
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TAZMO will showcase cutting-edge bonding technologies that support next‑generation semiconductor packaging. We will introduce the Laser-Assisted Wafer-level Bonding System, which enables bonding without heating the entire wafer by using laser heating, and the High Precision Direct Transfer Cow Bonder, which achieves high‑accuracy alignment and low particle generation. From MEMS to advanced packages, we invite you to experience our unique technologies that contribute to high quality and high yield. - Title of Exhibitor Presentation
Laser Assisted Bonding (LAB) System for wafer-level bonding
TDC Corporation
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Introducing our newest showcase: Pushing the Boundaries of Precision.” We invite you to examine our ultra-high-precision components, including STAVAX blocks engineered to a 1 +/- 0.001mm tolerance across six stages, and quartz glass with a flatness under 0.3um. - Title of Exhibitor Presentation
TDC’s Ultra-Precision Technologies
Toray Industries, Inc.
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Advanced Packaging Materials for MEMS
Yokogawa Electric Corporation
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This exhibit highlights pressure-sensing technologies based on silicon resonant sensors. We present Pressure Transmitters EJX, Digital Manometer MT300, and Pressure Controller MC300 incorporating the electromagnetic force driven silicon resonant sensor, DPharp. We also showcase various sensor applications using the electrostatic force driven silicon resonant sensor, SDR. In addition, a Water pressure sensor adopted for Nankai Trough Seafloor Observation Network for Earthquakes and Tsunamis (N net) is exhibited. - Title of Exhibitor Presentation
Yokogawa’s Si Resonant Sensor Technology
